cup grinding wheel meaning in Chinese
杯形砂轮
Examples
- By using a wafer - rotating grinding machine , the influence of the main process factors including grit size of diamond grinding wheel , rotating speed of the wafer chuck table , rotating speed and the down feed rate of the cup grinding wheel on the material removal rate , spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated
摘要利用基于自旋转磨削原理的矽片超精密磨床，通过试验研究了砂轮粒度、砂轮转速、工件转速及砂轮进给速度等主要因素对材料去除率、砂轮主轴电机电流以及磨削后矽片表面粗糙度的影响关系。